| 摘要 |
<p>According to one aspect of the present invention, there is provided a heat spreader to be mounted on an IC package, the IC package including: a circuit board; an IC chip mounted on one surface of the circuit board; and a plurality of connection terminals formed on the other surface of the circuit board, the heat spreader including: a top wall formed into a rectangular shape; a circumferential wall formed continuously from the top wall, the circumferential wall and the top wall defining a block-like cavity for enclosing the IC chip when the heat spreader is mounted on the IC package; and ear portions formed at lengthwise central portions of a facing pair of side walls of the circumferential wall so to extend outwardly from bottom edges of the facing pair of side walls, respectively.</p> |
