发明名称 半導体装置の設計支援方法
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device, having improved manufacturing efficiency of the semiconductor device. <P>SOLUTION: The method for manufacturing the semiconductor device includes: an acquisition step (step S12) for acquiring electric characteristics for each angle of layout of a transistor; an extraction step (steps S13, S14) for extracting the delay information of a basic cell having a transistor for each angle of layout of the basic cell based on the electric characteristics; and a verification process (step S15) for verifying the timing of a circuit block configured of the basic cell based on the delay information. Thus, the method for manufacturing a semiconductor device has improved manufacturing efficiency of the semiconductor device. <P>COPYRIGHT: (C)2010,JPO&INPIT</p>
申请公布号 JP5721934(B2) 申请公布日期 2015.05.20
申请号 JP20090062476 申请日期 2009.03.16
申请人 发明人
分类号 G06F17/50 主分类号 G06F17/50
代理机构 代理人
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