| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a solid state imaging device, which can remain a flat part in circumference of a bent part obtained by bending three-dimensionally an imaging region, thereby making it difficult for damage such as a crack to occur. <P>SOLUTION: A method for manufacturing a solid state imaging device comprises: producing a device chip 2 with photoelectric conversion parts being arranged on one main surface side; preparing a pedestal 21 constructed using a material having a larger expansion coefficient than that of the device chip 2, the pedestal having an opening 23 whose circumference is shaped as a flat surface 25; heating the pedestal 21 to be expanded; putting the device chip 2 on the flat surface 25 of the pedestal 21, in a state of covering the opening 23 of the pedestal 21; thereafter cooling the pedestal 21 to be shrunk, in a state of fixing the device chip 2 on the flat surface 25 of the expanded pedestal 21; and thereby bending three-dimensionally a portion corresponding to the opening 23, in the device chip 2. <P>COPYRIGHT: (C)2012,JPO&INPIT</p> |
