发明名称 部品実装装置、情報処理装置、位置検出方法及び基板製造方法
摘要 <p>A component mounting device includes a transport unit which transports a substrate, a mounting unit which mounts a component on the substrate, a detection unit which is able to detect a first detection target which is provided on the substrate and a second detection target which is provided to be separated by a predetermined distance from the first detection target on the substrate at least in the transportation direction and is a reference position of a mounting action by the mounting unit, and a control unit which outputs a stop signal for stopping the transport of the substrate to the transport unit and detects the second detection target of the substrate which has been stopped using the detection unit based on the detection of the first detection target by the detection unit.</p>
申请公布号 JP5721072(B2) 申请公布日期 2015.05.20
申请号 JP20110078448 申请日期 2011.03.31
申请人 发明人
分类号 H05K13/04 主分类号 H05K13/04
代理机构 代理人
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