| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an electronic apparatus achieving high cooling performance. <P>SOLUTION: An electronic apparatus 100 has multiple electronic components in a housing. The electronic apparatus 100 includes: a heat sink 2 disposed on an upper surface of the housing; a coolant cooling part 12e located adjacent to the heat sink 2; a downward flow passage 12a guiding a coolant from the coolant cooling part 12e to a lower part of the housing; an upward flow passage 12c, 12d guiding the coolant moved to the lower part of the housing by the downward flow passage 12a to the coolant cooling part 12e again. The electronic components 22, which are cooled, are disposed on an inner walls of the upward flow passages 12c, 12d. The heat conductivity of a wall member 6 forming the downward flow passage is smaller than the heat conductivity of wall members 8a, 8b forming the upward flow passages where the electronic components are attached. <P>COPYRIGHT: (C)2013,JPO&INPIT</p> |
