| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a surface mount component removal method, surface mount component removal device, and semiconductor package manufacturing method, in which overheating is prevented by accurately detecting the time at which solder is fused. <P>SOLUTION: A surface mount component removal method includes the steps of: holding a surface mount component which is fixed on a substrate by solder using a holding hand provided on a hand mechanism; applying a constant pressure to the hand mechanism in a direction along the surface of the substrate; fusing the solder by heating the surface mount component; detecting, during the fusion of the solder, fluctuation of the applied pressure due to the lateral deviation of the surface mount component; and retracting the holding hand upward when the fluctuation of the applied pressure becomes greater than a predetermined value, thereby separating the surface mount component from the substrate. <P>COPYRIGHT: (C)2013,JPO&INPIT</p> |
