WATER REMOVING METHOD, OPTICAL FIBER SOLDERING METHOD, AND SEMICONDUCTOR LASER MODULE MANUFACTURING METHOD

摘要

A removing method of the present invention removes moisture contained in a dielectric film (12) provided on one end surface (11a) of an optical fiber (10). The removing method of the present invention causes near infrared light (L) to enter the optical fiber (10) through the other end surface (11b) to heat moisture in the dielectric film (12) with use of the near infrared light (L).