Apparatus, system and method for use in mounting electronic elements

摘要

The present embodiments provide surface mount devices and/or systems. In some embodiments, the surface mount devices comprise a casing having a recess formed extending at least partially into said casing; and first and second leads each of which is at least partially encased by said casing and each of which has a portion exposed through said recess, wherein at least one of said first and second leads has one or more size reduction features in its said exposed portion that reduces the surface area to provide an increased surface bonding area to said casing around said lead.

主权项

1. A surface mount device comprising:
a casing having a recess formed extending at least partially into said casing; and first and second leads each of which is at least partially encased by said casing and each of which has a portion exposed through said recess, wherein at least one of said first and second leads has one or more size reduction features in its said exposed portion that reduces the surface area to provide an increased surface bonding area to said casing around said lead; wherein one of said exposed lead portions comprises a chipset carrier element comprising at least two of said size reduction features such that at least a portion of said chipset carrier element comprises first and second indentations opposite and parallel one another such that the width of said chipset portion narrows between said first and second indentations; wherein said chipset portion adjoins a termination end; wherein said termination end is wider than the area between said first and second indentations.