Ultrasonic sensor microarray and method of manufacturing same

摘要

A sensor assembly including one or more capacitive micromachined ultrasonic transducer (CMUT) microarray modules which are provided with a number of individual transducers. The microarray modules are arranged to simulate or orient individual transducers in a hyperbolic paraboloid geometry. The transducers/sensor are arranged in a rectangular or square matrix and are activatable individually, selectively or collectively to emit and received reflected beam signals at a frequency of between about 100 to 170 Hz.

主权项

1. A method of forming a capacitive micromachined transducers (CMUT) microarray comprising a plurality of transducers, said method comprising,
providing a first silicon wafer having generally planar, parallel top and bottom surfaces, said first wafer having a thickness selected at between about 300 and 500 microns, photo-plasma etching said top surface of the first wafer to form a plurality of pockets therein, each of said pockets having a common geometric shape, each of said pockets characterized by a respective sidewall extending generally normal to said top surface and extending to a depth of between about 0.2 and 5 microns, providing a second silicon wafer having generally planar, parallel top and bottom surfaces, said second wafer having a thickness selected at between about 0.05 and 5 microns, and preferably 0.2 and 2 microns as a device layer, contiguously sealing the bottom surface of the second wafer over the top surface of the first wafer to substantially seal each pocket as a transducers air gap, applying a conductive metal layer to at least part of at least one of the bottom surface of the first wafer and the top surface of the second wafer.