Electronic device

摘要

An electronic device includes a motherboard, a plurality of heating modules arranged on the motherboard, a first electronic module arranged on a front side of the motherboard along a longitudinal direction, a second electronic module stacked above the first electronic module, a wind scooper and a fan module being located on a rear side of the motherboard along the transverse direction and facing the heating modules and the second electronic module. The wind scooper covers the heating modules, and has a partition board to form a lower-layer airflow passage and an upper-layer airflow passage. The wind scooper guides a first airflow from the fan module to flow through the heating modules along the lower-layer airflow passage, and guides a second airflow from the fan module to flow to the second electronic module through the upper-layer airflow passage, without flowing through the heating modules.

主权项

1. An electronic device, comprising:
a motherboard; a plurality of heating modules, arranged on the motherboard; a first electronic module, arranged on a front side of the motherboard along a longitudinal direction perpendicular to a transverse direction; a second electronic module, arranged on the front side of the motherboard, and further stacked above the first electronic module; a fan module, being located on a rear side of the motherboard along the transverse direction, and further facing the heating modules and the second electronic module; and a wind scooper, wherein the wind scooper covers the heating modules and has a partition board extending toward the first electronic module, so as to form a lower-layer airflow passage between the partition board and the motherboard and form an upper-layer airflow passage above the partition board; wherein the wind scooper guides a first airflow provided by the fan module to flow through the heating modules along the lower-layer airflow passage, and guides a second airflow provided by the fan module to flow to the second electronic module along the upper-layer airflow passage without flowing through the heating modules.