| 发明名称 | Light source module | ||
| 摘要 | The light source module includes a circuit board adapted to be placed on a mounting base of a light source holding member, and a power feeding attachment to supply power to a semiconductor light emitting device, the circuit board including a board part on which the semiconductor light emitting device is mounted, and a conductive circuit formed on a surface of the board part and having a pair of terminal parts and a light source connection part to connect the pair of terminal parts and the semiconductor light emitting device, the power feeding attachment including an electrically-insulating portion and an conductive portion partially embedded in the electrically-insulating portion, the power feeding attachment being adapted to be attached to the light source holding member such that the electrically-insulating portion presses at least a portion of the circuit board against the mounting base. | ||
| 申请公布号 | US9035346(B2) | 申请公布日期 | 2015.05.19 |
| 申请号 | US201214003158 | 申请日期 | 2012.02.14 |
| 申请人 | KOITO MANUFACTURING CO., LTD. | 发明人 | Matsunaga Takashi;Watanabe Shigeyuki;Tsukamoto Hironori;Sato Ryuho |
| 分类号 | H01L21/00;H01L33/64;F21S8/10 | 主分类号 | H01L21/00 |
| 代理机构 | Sughrue Mion, PLLC | 代理人 | Sughrue Mion, PLLC |
| 主权项 | 1. A light source module comprising: a circuit board having a surface on which a semiconductor light emitting device is mounted, wherein the circuit board is adapted to be placed on a mounting base of a light source holding member, and a power feeding attachment to supply power to the semiconductor light emitting device, wherein the circuit board comprises: a board part on which the semiconductor light emitting device is mounted; and a conductive circuit formed on the surface of the board part, the conductive circuit including a pair of terminal parts and a light source connecting part to connect the pair of terminal parts and the semiconductor light emitting device, wherein the power feeding attachment comprises: an electrically-insulating portion formed of an electrically-insulating material having a thermal conductivity of 5.0 to 10.0 W/m·K; and a conductive portion formed of a conductive material and embedded in the electrically-insulating portion except a portion thereof, and wherein the power feeding attachment is adapted to be attached to the light source holding member such that the electrically-insulating portion presses at least a portion of the circuit board against the mounting base. | ||
| 地址 | Tokyo JP | ||