发明名称 |
TEMPERATURE COMPENSATION FOR SILICON MEMS RESONATOR |
摘要 |
<p>Thermally induced frequency variations in a micromechanical resonator are actively or passively mitigated by application of a compensating stiffness, or a compressive/tensile strain. Various composition materials may be selected according to their thermal expansion coefficient and used to form resonator components on a substrate. When exposed to temperature variations, the relative expansion of these composition materials creates a compensating stiffness, or a compressive/tensile strain.</p> |
申请公布号 |
CA2805322(C) |
申请公布日期 |
2015.05.19 |
申请号 |
CA20042805322 |
申请日期 |
2004.03.30 |
申请人 |
ROBERT BOSCH GMBH |
发明人 |
LUTZ, MARKUS;PARTRIDGE, AARON |
分类号 |
B81C1/00;B81B3/00;H01P7/10;H03H;H03H9/00;H03H9/02;H03H9/24;H03H9/50;H03H9/54 |
主分类号 |
B81C1/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|