Interconnection substrate design supporting device, method of designing interconnection substrate, program, and interconnection substrate

摘要

A via disposition information acquiring unit acquires via disposition information indicating a disposition of the plurality of first vias (212). A second conductor information acquiring unit acquires second conductor information indicating disposition positions of a plurality of second conductors (232) repeatedly disposed in the second conductor layer (230). A via extracting unit extracts an extraction via with respect to each of the plurality of second conductors (232). The extraction via is each of the first vias (212) overlapping the second conductor (232). A via selecting unit selects a selection via with respect to each of the plurality of second conductors (232). The selection via is each of first vias (212) selected in a predetermined number from the extraction vias. An opening introducing unit introduces a first opening (234) to each of the plurality of second conductors (232). The first opening (234) overlaps the extraction via not selected by the via selecting unit in plan view.

主权项

1. An interconnection substrate comprising:
a first conductor layer in which a first conductor is provided; a second conductor layer in which a plurality of second conductors are repeatedly provided at regions, each overlapping the first conductor in plan view; and a plurality of first vias having one end connecting to the first conductor and the other end penetrating through the second conductor layer, wherein each of the plurality of second conductors connects to the first conductor through either the first vias or a second via, a second conductor of the plurality of second conductors connects to a first one of the plurality of first vias, and includes an opening at a region overlapping a second one of the plurality of first vias, and said first conductor, said second conductor and said first one of the plurality of first vias connecting to said second conductor configure at least a part of a metamaterial structure.