Devices and stacked microelectronic packages with parallel conductors and intra-conductor isolator structures and methods of their fabrication

摘要

Embodiments of devices and methods of their manufacture include coupling first and second package surface conductors to a package surface with an intra-conductor insulating structure between the package surface conductors. The package surface conductors extend between and electrically couple sets of pads that are exposed at the package surface. Elongated portions of the package surface conductors are parallel with and adjacent to each other. The intra-conductor insulating structure is coupled between the package surface conductors along an entirety of the parallel and adjacent elongated portions, and the intra-conductor insulating structure electrically insulates the elongated portions of the package surface conductors from each other. Some embodiments may be implemented in conjunction with a stacked microelectronic package that includes sidewall conductors and an intra-conductor insulating structure between and electrically insulating the sidewall conductors from each other.

主权项

1. A device, comprising: a package body having a package surface; multiple pads that are exposed at the package surface and are electrically coupled to one or more electrical components embedded within the package body; a first package surface conductor coupled to the package surface and having a first elongated portion, wherein the first package surface conductor extends between and electrically couples a first set of the pads; a second package surface conductor coupled to the package surface and having a second elongated portion, wherein the first and second elongated portions are parallel with and adjacent to each other, and wherein the second package surface conductor extends between and electrically couples a second set of the pads; and a first intra-conductor insulating structure coupled between the first and second package surface conductors along an entirety of the first and second elongated portions of the first and second package surface conductors, wherein the first intra-conductor insulating structure is configured to electrically insulate the first and second elongated portions of the first and second package surface conductors from each other; the one or more electrical components include a first microelectronic device embedded within a first microelectronic package having a first sidewall, and a second microelectronic device embedded within a second microelectronic package having a second sidewall; the first and second microelectronic packages are stacked in a vertical arrangement; the first set of pads includes a first sidewall pad and a second sidewall pad, wherein the first sidewall pad is positioned at the first sidewall and is electrically coupled with the first microelectronic device through a first device-to-edge conductor, and the second sidewall pad is positioned at the second sidewall and is electrically coupled with the second microelectronic device through a second device-to-edge conductor.