发明名称 |
Method for manufacturing a semiconductor substrate |
摘要 |
The invention relates to a method for manufacturing a semiconductor substrate, in particular, a semiconductor-on-insulator substrate by providing a donor substrate and a handle substrate, forming a pattern of one or more doped regions typically inside the handle substrate, and then attaching such as by molecular bonding the donor substrate and the handle substrate to obtain a donor-handle compound. |
申请公布号 |
US9035474(B2) |
申请公布日期 |
2015.05.19 |
申请号 |
US201012793515 |
申请日期 |
2010.06.03 |
申请人 |
Soitec |
发明人 |
Mazure Carlos;Ferrant Richard;Bourdelle Konstantin;Nguyen Bich-Yen |
分类号 |
H01L23/544;H01L21/762;H01L21/18;H01L21/20 |
主分类号 |
H01L23/544 |
代理机构 |
TraskBritt |
代理人 |
TraskBritt |
主权项 |
1. A method for manufacturing a semiconductor substrate, comprising:
providing a donor substrate and a semiconductor handle substrate; implanting ions into the semiconductor handle substrate and forming one or more alignment marks buried completely inside the semiconductor handle substrate by the implantation of the ions, the one or more alignment marks being configured to be detectable using electromagnetic radiation in the infrared region of the electromagnetic spectrum; forming a plurality of doped regions buried completely inside the semiconductor handle substrate, each doped region of the plurality of doped regions comprising one or more dopants; and attaching the donor substrate and the semiconductor handle substrate together by molecular bonding to obtain a donor-handle combination, at least one of the donor substrate and the handle substrate including a surface layer of an insulator such that the donor-handle combination forms a semiconductor-on-insulator semiconductor substrate. |
地址 |
Bernin FR |