发明名称 Semiconductor device
摘要 A pMIS region is provided between a boundary extending in a first direction and passing through each of a plurality of standard cells and a first peripheral edge. An nMIS region is provided between the boundary and a second peripheral edge. A power supply wiring and a grounding wiring extend along the first and second peripheral edges, respectively. A plurality of pMIS wirings and a plurality of nMIS wirings are arranged on a plurality of first virtual lines and a plurality of second virtual lines, respectively, extending in the first direction and arranged with a single pitch in a second direction. The first virtual line that is the closest to the boundary and the second virtual line that is the closest to the boundary have therebetween a spacing larger than the single pitch.
申请公布号 US9035392(B2) 申请公布日期 2015.05.19
申请号 US201414185801 申请日期 2014.02.20
申请人 RENESAS ELECTRONICS CORPORATION 发明人 Tsuda Nobuhiro;Nishimaki Hidekatsu;Omura Hiroshi;Yoshifuku Yuko
分类号 H01L27/092;H01L27/02;H01L27/118 主分类号 H01L27/092
代理机构 McDermott Will & Emery LLP 代理人 McDermott Will & Emery LLP
主权项 1. A semiconductor device having a plurality of standard cells formed on a semiconductor substrate, each of said plurality of standard cells comprising: a first power supply wiring formed on a main surface of said semiconductor substrate and extending in a first direction; a second power supply wiring formed on a main surface of said semiconductor substrate and extending in said first direction, said first and second power supply wirings being arranged at a predetermined interval in a second direction which is substantially perpendicular with said first direction in a plan view; a field oxide layer formed in said main surface of said semiconductor substrate between said first and second power supply wirings in said plan view and extending in said first direction; an n-type well formed in said main surface of said semiconductor substrate between said first power supply wiring and said field oxide layer in said plan view and extending in said first direction; a p-type well formed in said main surface of said semiconductor substrate between said second power supply wiring and said field oxide layer in said plan view and extending in said first direction; a plurality of p-type MIS transistors formed on said n-type well, each of said plurality of p-type MIS transistors having a gate electrode on said n-type well and p-type source and drain regions in said n-type well at both sides of said gate electrode; a plurality of n-type MIS transistors formed on said p-type well, each of said plurality of n-type MIS transistors having a gate electrode on said p-type well and n-type source and drain regions in said p-type well at both sides of said gate electrode, each of said gate electrodes of said plurality of p-type MIS transistors and said n-type MIS transistors extending in said second direction; a plurality of first metal wirings formed over said n-type well and extending in said first direction, said plurality of first metal wirings being arranged between said first power supply wiring and said field oxide layer in said plan view and being formed of a same level metal layer as that of said first power supply wiring; and a plurality of second metal wirings formed over said p-type well and extending in said first direction, said plurality of second metal wirings being arranged between said second power supply wiring and said field oxide layer in said plan view and being formed of the same level metal layer as that of said first power supply wiring, said second power supply wiring and said plurality of first metal wirings; wherein said plurality of first metal wirings are arranged in one another at a first predetermined interval in said second direction in said plan view, wherein said plurality of second metal wirings are arranged in one another at the same interval as said first predetermined interval in said second direction in said plan view, wherein said plurality of first metal wirings includes a first one that is closest to said field oxide layer, and said plurality of second metal wirings includes a second one that is closest to said field oxide layer, and wherein a second predetermined interval defined by said first one and second one of said plurality of first and second metal wirings is wider than said first predetermined interval.
地址 KANAGAWA JP