| 发明名称 | Semiconductor package and method of fabricating the same | ||
| 摘要 | A semiconductor package, comprising: a semiconductor substrate; a mold layer on the semiconductor substrate; and a marking formed on a surface of the mold layer, the marking comprising dot markings substantially discontinuously arranged in vertical and horizontal directions of a display region. An effective area of the dot markings within a unit display region of the marking is smaller than about half a total area of the unit display region. | ||
| 申请公布号 | US9035308(B2) | 申请公布日期 | 2015.05.19 |
| 申请号 | US201414197203 | 申请日期 | 2014.03.04 |
| 申请人 | SAMSUNG ELECTRONICS CO., LTD. | 发明人 | Yim Choongbin;Kang Hyeongmun;Park Taesung;Ahn Eunchul |
| 分类号 | H01L23/58;G01R31/26;H01L23/544;H01L21/3105 | 主分类号 | H01L23/58 |
| 代理机构 | Renaissance IP Law Group LLP | 代理人 | Renaissance IP Law Group LLP |
| 主权项 | 1. A semiconductor package, comprising: a semiconductor substrate; a mold layer on the semiconductor substrate; and a marking formed on a surface of the mold layer, the marking comprising dot markings substantially discontinuously arranged in vertical and horizontal directions of a display region; wherein an effective area of the dot markings within a unit display region of the marking is smaller than about half a total area of the unit display region. | ||
| 地址 | KR | ||