Semiconductor device and method of manufacturing the same

摘要

An object of the invention is to provide a smaller semiconductor device of which the manufacturing process is simplified and the manufacturing cost is reduced and a method of manufacturing the same. Furthermore, an object of the invention is to provide a semiconductor device having a cavity. A first supporting body 5 having a penetration hole 6 penetrating it from the front surface to the back surface is attached to a front surface of a semiconductor substrate 2 with an adhesive layer 4 being interposed therebetween. A device element 1 and wiring layers 3 are formed on the front surface of the semiconductor substrate 2. A second supporting body 7 is attached to the first supporting body 5 with an adhesive layer 8 being interposed therebetween so as to cover the penetration hole 6. The device element 1 is sealed in a cavity 9 surrounded by the semiconductor substrate 2, the first supporting body 5 and the second supporting body 7.

主权项

1. A method of manufacturing a semiconductor device, comprising:
attaching a first supporting body to a semiconductor substrate with an adhesive layer, a metal wiring layer being formed on the semiconductor substrate; after the step of attaching the first supporting body, forming a penetration hole penetrating the first supporting body from a front surface to a back surface of the first supporting body by removing a part of the first supporting body; subsequently attaching a second supporting body to the first supporting body with an adhesive layer so as to cover the penetration hole, to seal a device element in a cavity formed by covering the penetration hole of the first supporting body by the semiconductor substrate and the second supporting body, and to include the metal wiring layer in the cavity; and wherein the two adhesive layers are each made of an organic material, and the first supporting body is made of an insulating material.