Integrated circuit packaging system with a lead and method of manufacture thereof

摘要

A method of manufacture of an integrated circuit packaging system includes: forming a package paddle; forming a lead adjacent to the package paddle; depositing a lead conductive cap on the lead, the lead conductive cap includes a nickel layer having a thickness between 2.55 μm to 8.00 μm deposited on the lead, a palladium layer deposited on the nickel layer, and a gold layer deposited on the palladium layer; mounting an integrated circuit over the package paddle; attaching an electrical connector between the lead conductive cap and the integrated circuit; and forming an encapsulation over the integrated circuit, a portion of the lead, and a portion of the package paddle.

主权项

1. A method of manufacture of an integrated circuit packaging system comprising:
forming a package paddle having a paddle recess and a paddle bottom side, the paddle recess forms non-horizontal sidewalls into the package paddle, the non-horizontal sidewalls are perpendicular to the paddle bottom side; forming a lead adjacent to the package paddle; forming a lead conductive cap, having a pure nickel inner region with a thickness between 0.05 μm to 6.00 μm and having a tin-palladium-gold intermetallic region, on the lead including:
depositing a nickel layer having a thickness between 2.55 μm to 8.00 μm on the lead,depositing a palladium layer on the nickel layer, anddepositing a gold layer on the palladium layer; mounting an integrated circuit over the package paddle; attaching an electrical connector between the lead conductive cap and the integrated circuit; and forming an encapsulation over the integrated circuit, a portion of the lead, and a portion of the package paddle.