发明名称 Semiconductor device and method of fabricating the same
摘要 A semiconductor device includes an interlayer insulating film on a substrate, the interlayer insulating film including a trench, a gate insulating film in the trench, a diffusion film on the gate insulating film, the diffusion film including a first diffusion material, a gate metal structure on the diffusion film, the gate metal structure including a second diffusion material, and a diffusion prevention film between the gate metal structure and the diffusion film, the diffusion prevention film being configured to prevent diffusion of the second diffusion material from the gate metal structure, the first diffusion material diffused from the diffusion film exists in the gate insulating film.
申请公布号 US9035398(B2) 申请公布日期 2015.05.19
申请号 US201314010961 申请日期 2013.08.27
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 Won Seok-Jun;Kim Suk-Hoon;Jung Hyung-Suk
分类号 H01L29/66;H01L29/78;H01L21/8238;H01L21/28;H01L29/49;H01L29/51 主分类号 H01L29/66
代理机构 Lee & Morse, P.C. 代理人 Lee & Morse, P.C.
主权项 1. A semiconductor device, comprising: an interlayer insulating film on a substrate, the interlayer insulating film including a trench; a gate insulating film in the trench, the gate insulating film being conformal along sidewalls and a bottom surface of the trench; a diffusion film on the gate insulating film, the diffusion film including a first diffusion material; a work function adjustment film under the diffusion film, the work function adjustment film including the first diffusion material; a gate metal structure on the diffusion film, the gate metal structure including a second diffusion material; and a diffusion prevention film between the gate metal structure and the diffusion film, the diffusion prevention film being configured to prevent diffusion of the second diffusion material from the gate metal structure, wherein a first diffused material diffused from the diffusion film exists in the gate insulating film.
地址 Suwon-si, Gyeonggi-do KR