Light emitting device package and lighting system

摘要

A light emitting device (LED) package includes a submount and a light emitting chip. The submount has a chip region and a supporting region over which the chip is mounted, and an encapsulating material and fluorescent material are formed over the chip. The coverage area of encapsulating and fluorescent materials is substantially coextensive with the chip or chip region, and a first area between an edge of the chip region and an edge of the supporting region is greater than a second area between the edge of the chip region and the chip.

主权项

1. A light emitting device package comprising:
a submount including a chip region and a supporting region; a light emitting chip over the chip region of the submount; and an encapsulating material and a fluorescent material over the chip, wherein: the encapsulating material is at least partially transparent, a coverage area of the encapsulating material and fluorescent material is substantially coextensive with the chip region, a top surface of the chip region includes at least one groove between the light emitting chip and an edge of the chip region, the encapsulating material extending into the at least one groove, and the chip region comprises a sidewall, wherein a bottom-most portion of the sidewall is lower than the at least one groove, wherein a lateral width of a third region between the at least one groove and the chip is smaller than a lateral width of the supporting region.