| 发明名称 | Method of inspecting wafer | ||
| 摘要 | A method of inspecting a wafer includes performing a fabricating process on a wafer, irradiating broadband light on the wafer, such that the light is reflected from the wafer, generating a spectral cube by using the light reflected from the wafer, extracting a spectrum of a desired wafer inspection region from the spectral cube, and inspecting the desired wafer inspection region by analyzing the extracted spectrum. | ||
| 申请公布号 | US9036895(B2) | 申请公布日期 | 2015.05.19 |
| 申请号 | US201313785307 | 申请日期 | 2013.03.05 |
| 申请人 | SAMSUNG ELECTRONICS CO., LTD. | 发明人 | Sohn Young-hoon;Yang Yu-sin;Lee Sang-kil |
| 分类号 | G06K9/00;G06T7/00 | 主分类号 | G06K9/00 |
| 代理机构 | Lee & Morse, P.C. | 代理人 | Lee & Morse, P.C. |
| 主权项 | 1. A method of inspecting a wafer, the method comprising: performing a fabricating process on a wafer; irradiating broadband light on the wafer, such that the light is reflected from the wafer; generating a spectral cube using the light reflected from the wafer; extracting a spectrum of a desired wafer inspection region from the spectral cube; and inspecting the desired wafer inspection region by analyzing the extracted spectrum using a spectrum of the desired wafer inspection region, which is included in a spectrum recognition algorithm. | ||
| 地址 | Suwon-si, Gyeonggi-do KR | ||