Passive cooling system and method for electronics devices

摘要

An apparatus for passively cooling electronics. The apparatus for passively cooling electronics includes at least one heat pipe and at least one heat sink thermally coupled to a bridge plate. When a cradle is thermally coupled to the at least one heat pipe, the at least one heat sink draws heat from the cradle.

主权项

1. An apparatus for passively cooling electronics comprising:
a cradle configured to dock an electronic component such that the cradle is thermally coupled to the electronic component; a back plane printed circuit board (PCB) configured to provide an electrical connection for the electronic component; a bridge plate thermally coupled to a heat sink; and a heat pipe thermally connecting the cradle to the bridge plate through the back plane printed circuit board (PCB).