Package member assembly, method for manufacturing the package member assembly, package member, and method for manufacturing piezoelectric resonator device using the package member

摘要

[Solving means] In a package member assembly, a plurality of package members are integrally formed. The package member assembly includes a plurality of bottomed holes provided on a front main face and a back main face of a wafer made of glass, and external terminals connected to side-face conductors attached to inner wall faces of the bottomed holes on the back main face.

主权项

1. A package member assembly in which a plurality of package members are integrally formed from repeating rectangular sections, the package members being rectangular when viewed from above,
wherein a plurality of bottomed holes are formed on at least a back main face of a wafer made of glass or crystal, the bottomed holes are formed along a periphery of the back main face of each repeating rectangular section and on two adjacent sides of the back main face of each repeating rectangular section, a plurality of external terminals are formed on the back main face of the wafer, and the external terminals are connected to side-face conductors attached to inner wall faces of the bottomed holes on the back main face of each repeating rectangular section.