Substrate processing method

摘要

A method for processing a plurality of substrates after forming a photosensitive film on each substrate includes carrying each substrate into a placement buffer including a plurality of supporters by a first transport mechanism; taking out each substrate from the placement buffer to an interface by a second transport mechanism; carrying each substrate into the exposure device; carrying each substrate out of the exposure device into the placement buffer by the second transport mechanism; taking out each substrate from the placement buffer to the processing section by the first transport mechanism; performing development processing on each substrate; making each substrate stand by at the placement buffer based on timing at which the exposure device can accept each substrate; and making each substrate stand by at the placement buffer based on timing at which the developing device can accept each substrate.

主权项

1. A substrate processing method for processing a plurality of substrates in a substrate processing apparatus that is arranged adjacent to an exposure device and includes a processing section and an interface, the method comprising the steps of:
performing film formation processing of forming a photosensitive film made of a photosensitive material on each substrate in a film formation device of the processing section; carrying each substrate after the film formation processing into a placement buffer including a plurality of supporters for supporting a plurality of substrates one above another by a first transport mechanism provided in the processing section, wherein each substrate is carried into any one of the plurality of supporters; taking out each substrate after the film formation processing from the placement buffer to the interface by a second transport mechanism provided in the interface; carrying each substrate after the film formation processing taken out from the placement buffer to the interface into the exposure device; carrying each substrate after exposure processing by the exposure device out of the exposure device; carrying each substrate after the exposure processing into any one of the supporters in the placement buffer by the second transport mechanism; taking out each substrate after the exposure processing from the placement buffer to the processing section by the first transport mechanism; performing development processing on each substrate after the exposure processing taken out from the placement buffer to the processing section in a developing device of the processing section; selectively making one or a plurality of substrates stand by at the placement buffer depending on timing at which the exposure device can accept each substrate in a course of transporting each substrate from the processing section via the interface to the exposure device; and selectively making one or a plurality of substrates stand by at the placement buffer depending on timing at which the developing device can accept each substrate in a course of transporting each substrate from the exposure device via the interface to the developing device, wherein the placement buffer is provided and configured so as to enable the plurality of substrates to stand by simultaneously before the exposure processing by the exposure device, and to enable the plurality of substrates to stand by simultaneously after the exposure processing by the exposure device.