BONDING DEVICE AND BONDING SYSTEM

摘要

PROBLEM TO BE SOLVED: To appropriately hold substrates when bonding the substrates with each other, and appropriately perform bonding processing of the substrates.SOLUTION: A bonding device 41 comprises: an upper chuck 140 vacuum-drawing, sucking, and holding an upper wafer Won its lower surface; and a lower chuck 141 provided below the upper chuck 140, and vacuum-drawing, sucking, and holding a lower wafer Won its upper surface. The lower chuck 141 comprises: a main body part 190 vacuum-drawing the whole surface of the lower wafer W; a plurality of pins 191 provided on the main body part 190, and come into contact with a rear face of the lower wafer W; and a supporting part 192 provided on the main body part 190 and outside the plurality of pins 191, and having a contact area smaller than an outer peripheral part of the lower wafer Wso as to support the outer peripheral part of the lower wafer Wwhen the lower chuck 141 vacuum-draws the outer peripheral part of the lower wafer W.