| 摘要 |
PROBLEM TO BE SOLVED: To provide a through-electrode useful for a circuit board of a multilayer structure, which enables the decrease in wiring length of a device such as MEMS, and which is arranged to be able to adapt to airtight sealing.SOLUTION: A through-electrode is to be provided on a substrate having a through-hole. The through-electrode comprises: a through-part extending through the through-hole; a convex bump part formed in at least one end of the through-part, and having a width larger than that of the through-electrode; and at least one layer of metal film formed on a contact face of the convex bump part with the substrate. Each of the through-electrode part and the convex bump part is formed from a sintered compact produced by sintering metal powder of at least one material selected from among gold, silver, palladium and platinum; the metal powder has a purity of 99.9 wt.% or more, and an average particle diameter of 0.005-1.0 μm. The at least one metal film is made of any of gold, silver, palladium and platinum, which have a purity of 99.9 wt.% or more, and makes a through-electrode. |
