发明名称 CERAMIC ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide a ceramic electronic component capable of preventing vibration generated in a chip component from being transmitted to a mounting substrate through a metal terminal.SOLUTION: A ceramic electronic component with a metal terminal includes: a chip component having a pair of terminal electrodes 22 and 24 and formed in a substantially rectangular parallelepiped shape; and a pair of metal terminal portions 30 and 40, in which the terminal electrode is formed so as to spread over a part of side surfaces (20c, 20e) from an end surface of the chip component, and the metal terminal portion includes; a connection portion 36 which includes a connection surface extended in substantially parallel with the end surface and is connected to the terminal electrode; a plurality of coupling portions 37 and 47 which include a coupling surface extended in a direction different from the connection surface and are connected to the connection portion; and a plurality of mounting portions 38 and 48 which include a mounting portion-upper portion extended in a direction different from the coupling surface and in substantially parallel with any one of the side surfaces with a predetermined interval and are connected to the coupling portion.
申请公布号 JP2015095490(A) 申请公布日期 2015.05.18
申请号 JP20130232463 申请日期 2013.11.08
申请人 TDK CORP 发明人 MASUDA ATSUSHI;KOBAYASHI KAZUMI;YOSHII AKITOSHI
分类号 H01G2/06;H01G4/232;H01G4/30;H01G4/38 主分类号 H01G2/06
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