ELECTRONIC COMPONENT MODULE

摘要

PROBLEM TO BE SOLVED: To provide an electronic component module in which contact failure is hard to occur even when thermal shock is applied thereto.SOLUTION: An electronic component module 1 includes: an element 10; a conductive member 20 brazed to the element 10; and a placement surface 30 which is opposed to the element 10 out of the surface having the conductive member 20 and has a recess 60 opened to the side of the element 10. On the placement surface 30 which is the surface to which the element 10 in a copper plate 21 is soldered, a groove-shaped hollow opened toward the placement surface 30 is formed.