| 摘要 |
PROBLEM TO BE SOLVED: To provide an IC inlet having a reinforcement plate used for a non-contact IC card having a requirement in total thickness, the IC inlet having resistance against static electricity even in a configuration in which the reinforcement plate is exposed.SOLUTION: An IC inlet 11 is obtained by bonding an IC chip 4 to an antenna pattern 2 on an antenna substrate 1, molding the IC chip 4 by an encapsulation resin 5, and disposing a reinforcement plate 6 on the encapsulation resin 5. Film thickness 7 of the encapsulation resin between the IC chip 4 and the reinforcement plate 6 is 20-30 μm. |
