| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which enables each of solders located on both sides of a semiconductor element to be evaluated; and provide a manufacturing method of the semiconductor device.SOLUTION: A semiconductor device (10) comprises: semiconductor elements (12, 14): a first metallic component (18) arranged on one surface side of the semiconductor element; second metallic components (22, 24) arranged on a rear face side of the semiconductor element; and solders (16, 20) for electrically connecting the semiconductor with the first metallic component and the semiconductor element with the second metallic components, respectively. In order to correct warpage of the semiconductor element by sandwiching the semiconductor element from both sides, the first metallic component has a first support part (36a) and the second metallic components have second support parts (36b), respectively, which are arranged so as to sandwich the fist support part in at least one direction orthogonal to a lamination direction of the semiconductor element and each metallic component. The first support part and the second support parts contact the semiconductor element and the semiconductor element is held between the first support part and the second support parts. |
