| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a polishing liquid composition for a hard and brittle material enabling a high polishing speed and capable of keeping an initial polishing speed for a long period of time, and to provide a method for producing the hard and brittle material by using the same, and to provide a polishing method of the hard and brittle material.SOLUTION: A polishing liquid composition for a hard and brittle material is formed by mixing a large size silica particle (component A) having an average primary particle diameter of 80 to 500 nm, a small size silica particle (component B) having an average primary particle diameter of 5 to 70 nm, an organic acid and/or chelator (component C) and an aqueous medium (component D). In the polishing liquid composition for the hard and brittle material, a ratio of an average primary particle diameter (D) of the small size silica particle (component B) to intra-dry particle void diameter (P) of the large size silica particle (component A) (D/P), is 0.6 to 1.4, and a ratio of the mole number of the organic acid and/or chelator (component C) to the total mole number in terms of SiO2 of the large size silica particle and the small size silica particle, (the mole number of the component C/the total mole number of the component A and the component B), is 0.0005 to 0.01.</p> |
