发明名称 PIEZOELECTRIC WAFER AND PIEZOELECTRIC VIBRATION PIECE
摘要 <p>PROBLEM TO BE SOLVED: To take a piezoelectric vibration piece easily from a piezoelectric wafer while folding, and to perform frequency adjustment stably in the state of piezoelectric wafer, without causing short circuit or disconnection.SOLUTION: In a piezoelectric wafer (crystal wafer) having a piezoelectric vibration piece (crystal vibration piece) 2, a frame 3 supporting the piezoelectric vibration piece 2, and a coupling portion 4 for coupling the frame 3 and piezoelectric vibration piece 2, groove-like slits 13a-13d extending in the width direction of the coupling portion 4 are formed in the front and rear surfaces thereof. The electrode of the piezoelectric vibration piece 2 is led out to the frame 3 side via a portion of at least any one of the front and rear surface in the width direction.</p>
申请公布号 JP2015095834(A) 申请公布日期 2015.05.18
申请号 JP20130235325 申请日期 2013.11.13
申请人 DAISHINKU CORP 发明人 FUJII SATOSHI;SHIBUYA KOZO;ISHINO SATORU;MORIMOTO KENSHU
分类号 H03H9/19;H03H3/02;H03H9/02 主分类号 H03H9/19
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