| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a manufacturing method which can more reliably remove end materials generated in a dicing step, in the manufacturing method of a semiconductor device.SOLUTION: In a dicing step, fluid 5 is collided with a surface 2a on the side facing a dicing tool 4 among end materials generated by cutting work-piece. To be specific, the fluid 5 is introduced into a first space 10 through an entrance 10a of the first space 10 and is collided with the surface 2a of the end material. The first space 10 is a gap between the work-piece and the dicing tool 4 and a space for forming the entrance 10a through which the fluid 5 is introduced and is in contact with the surface 2a on the side facing the dicing tool 4 of the work-piece. Thus, by generating a force which acts in a direction of pushing the end materials up from the dicing tool 4 side, the end materials of the work-piece can more reliably be removed than conventional relatively without receiving influences of friction between the work-piece and the dicing tool 4.</p> |
