| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a probe device in which the insulation performance of a wafer chuck can be maintained in good state over a long term.SOLUTION: A wafer chuck 18 for suction holding a wafer W is composed of: a conductive chuck top 50 which is arranged on the upper side and has a table surface 52 for mounting the wafer W; and an insulating back plate 70 arranged on the lower side. Between the chuck top 50 and back plate 70, a space 100 becoming a gap is provided, and an opening 102 communicating with the space 100 and outside is formed in the outer periphery thereof. In the upper surface 72 of the back plate 70, a supply hole 90 is formed, the back plate 70 is dried by supplying dry air from the supply hole 90, and moisture absorption of the back plate 70 is prevented, thereby preventing the insulation performance from lowering.</p> |
