METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device capable of obtaining excellent connection reliability between semiconductor chips or between a semiconductor chip and a substrate.SOLUTION: A method for manufacturing a semiconductor device in which a semiconductor chip 3 including a bump is electrically connected to a substrate 5 including an electrode 8 corresponding to the bump via a thermosetting adhesive film 4 comprises: a step (A1) of laminating the thermosetting adhesive film in advance on a surface including the bump of the semiconductor chip; a step (B1) of laminating the thermosetting adhesive film in advance on the substrate including the electrode; and a step (C1) of hardening the thermosetting adhesive film by crimping a surface on the thermosetting adhesive film side of the semiconductor chip laminated with the thermosetting adhesive film and a surface on the thermosetting adhesive film side of the substrate laminated with the thermosetting adhesive film using a heat tool 1 and electrically connecting the bump of the semiconductor chip and the electrode of the substrate after the steps (A1) and (B1).