| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a non-epoxy resin composition for a prior supply type process.SOLUTION: A resin composition comprises (A) EO modified bisphenol A dimethacrylate (2.2 Bis[4-(Methacryloxy Ethoxy)Phenyl]Propane), (B) Tricylodecane Dimethanol Diacrylate, (C) Tricylodecane Dimethyl Monoacrylate, (D) organic peroxide, (E) butadiene and maleic anhydride copolymer, and (F) silica filler.</p> |
