| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a plating device that is adaptive to a longer plated object by suppressing abnormal deposition of metal.SOLUTION: A plating device 1 includes: a first plating bath 2; a first supply tank 3 which circulates a plating liquid to and from the first plating bath 2; a second plating bath 4; a second supply tank 5 which circulates the plating liquid to and from the second plating bath 4; a preliminary tank 7 in which the plating liquid can be recovered; a guide mechanism 6 which is configured to move between the first plating bath 2 and second plating bath 4, and dips a plated object in one plating bath selected between the first plating bath 2 and second plating bath 4; and a control part 10. Here, the control part 10 switches the first plating bath 2 and second plating bath 4 alternately such that the plating liquid is reserved in one plating bath and the other plating bath is emptied, and also switches the guide mechanism 6 as the plating baths 2, 4 are switched so as to reserve the plating liquid.</p> |
