ADHESIVE FILM, METHOD OF PRODUCING CONNECTION STRUCTURE, CONNECTION METHOD, AND CONNECTION STRUCTURE

摘要

PROBLEM TO BE SOLVED: To provide an adhesive film that secures a conductive property even in low pressure, and allows a plurality of electrode terminal parts and connection terminal parts to be connected in one heat compression process.SOLUTION: The adhesive film has a first adhesive layer 13, and a plurality of second adhesive layers 14 put on the same face of the first adhesive layer 13 and disposed on an electrode terminal part 8 of a connection object 6, respectively.