发明名称 THERMOSETTING RESIN COMPOSITION
摘要 <p>PROBLEM TO BE SOLVED: To provide a thermosetting resin composition which makes it possible to easily adjust the warpage of a resin package.SOLUTION: A thermosetting resin composition comprises a compound represented by general formula (1), and a (meth) glycidyl acrylate polymer.</p>
申请公布号 JP2015093905(A) 申请公布日期 2015.05.18
申请号 JP20130233316 申请日期 2013.11.11
申请人 NIPPON CARBIDE IND CO INC 发明人 TAKAMATSU HIROAKI;YAMAMOTO KYOKO;AZUMA HIDEO
分类号 C08L63/10;C08G59/40 主分类号 C08L63/10
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