| 摘要 |
The present invention relates to an induction heating soldering device and, more specifically, relates to an induction heating soldering device capable of partially heating both supplied lead and the soldering portions of a printed circuit board and electronic components. According to the present invention, the induction heating soldering device comprises: a high frequency power supply unit; an induction heating coil electrically connected to the high frequency power supply unit; and a magnetic core having a hollow cylinder shape formed of a magnetic substance to provide a path of magnetic flux induced by the induction heating coil comprising an inlet part through which a yarn is inserted in the hollow hole, and an outlet part to discharge the inserted lead. The magnetic core provides the path of the magnetic flux induced by the induction heating coil and comprises the inlet part to supply the lead to one end of the hollow hole, and the outlet part to discharge the lead. The outlet part of the magnetic core is arranged such that the magnetic flux can pass the discharged lead; thus heating and melting only the lead discharged from the magnetic core. |
