| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor module having a wiring connection part which achieves high joint strength and long life, and to provide a manufacturing method of the semiconductor module.SOLUTION: A semiconductor module of the invention includes: semiconductor elements 1, each of which has a first main surface and a second main surface facing the first main surface and includes a surface electrode located on the first main surface and a rear surface electrode located on the second main surface; a metal plate 4 which is electrically connected with the rear surface electrode of the semiconductor element 1 through a sintered joint material 2 using metal nanoparticles; and a plate-like conductor 5 which is electrically connected with the surface electrode of the semiconductor element 1 through the sintered joint material 2 using the metal nanoparticles. Grooves 6, which communicate joint regions joined to the semiconductor elements 1 to the exterior of the joint regions, are provided at the metal plate 4 and the conductor 5. |
