| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate processing device capable of preventing damage to a substrate.SOLUTION: There is provided a substrate processing device comprising: an electrostatic chuck which includes a chuck electrode and electrostatically attracts a substrate; a DC voltage source which is connected to the chuck electrode and applies voltage to the chuck electrode; and an exhaust device with a rotor which exhausts the heat transfer gas supplied to a rear surface of the electrostatically attracted substrate via a heat transfer gas exhaust pipe. The exhaust device is connected to the DC voltage source via a power supply line, and supplies regenerative electric power generated in the exhaust device to the DC voltage source. |
