发明名称 |
SEMICONDUCTOR DEVICE MANUFACTURING METHOD |
摘要 |
<p>PROBLEM TO BE SOLVED: To provide an art to reduce a load on a manufacturing process while inhibiting quality degradation of a semiconductor device.SOLUTION: A semiconductor device manufacturing method comprises: a preparation process S1 of growing a GaN-based semiconductor layer on a GaN substrate to form a laminate in which a plurality of island-shaped long GaN-based semiconductor layers are arranged on the GaN substrate in a stripe shape; and a device formation process S2 of forming a semiconductor device on a top face of the GaN-based semiconductor layers.</p> |
申请公布号 |
JP2015095585(A) |
申请公布日期 |
2015.05.18 |
申请号 |
JP20130234926 |
申请日期 |
2013.11.13 |
申请人 |
FURUKAWA CO LTD |
发明人 |
SUMIDA YUKITSUNE;NISHIGORI YUTAKA |
分类号 |
H01L21/205;C23C16/34;C30B29/38 |
主分类号 |
H01L21/205 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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