发明名称 SEMICONDUCTOR DEVICE MANUFACTURING METHOD
摘要 <p>PROBLEM TO BE SOLVED: To provide an art to reduce a load on a manufacturing process while inhibiting quality degradation of a semiconductor device.SOLUTION: A semiconductor device manufacturing method comprises: a preparation process S1 of growing a GaN-based semiconductor layer on a GaN substrate to form a laminate in which a plurality of island-shaped long GaN-based semiconductor layers are arranged on the GaN substrate in a stripe shape; and a device formation process S2 of forming a semiconductor device on a top face of the GaN-based semiconductor layers.</p>
申请公布号 JP2015095585(A) 申请公布日期 2015.05.18
申请号 JP20130234926 申请日期 2013.11.13
申请人 FURUKAWA CO LTD 发明人 SUMIDA YUKITSUNE;NISHIGORI YUTAKA
分类号 H01L21/205;C23C16/34;C30B29/38 主分类号 H01L21/205
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