发明名称 REPLACEMENT METHOD OF PRINTED WIRING BOARD FOR PRODUCT SHEET
摘要 <p>PROBLEM TO BE SOLVED: To easily adsorb and convey a product sheet by improving a packaging density of a printed wiring board in the product sheet.SOLUTION: A replacement method of a printed wiring board for a product sheet includes the steps of: removing a defective printed wiring board 10B from a product sheet 1; extracting a non-defective printed wiring board 10A from another product sheet; positioning and mounting the non-defective printed wiring board 10A in a predetermined location on a first pin board 20; positioning and affixing the non-defective printed wiring board 10A with a first jig board 30; positioning and affixing the product sheet 1 from which the defective printed wiring board 10B has been removed on a second jig board 40; mounting both the jig boards 30 and 40 on a second pin board 50 in such a manner that the non-defective printed wiring board 10A on the first jig board 30 and the product sheet 1 on the second jig board 40 oppose each other at a replacement position 4; and positioning and fixing the non-defective printed wiring board 10A on the product sheet 1 through thermal compression bonding.</p>
申请公布号 JP2015095636(A) 申请公布日期 2015.05.18
申请号 JP20130236166 申请日期 2013.11.14
申请人 FUJIKURA LTD 发明人 MOCHIZUKI KAZUTAKA;KODAMA TAKASHI;NAKAMICHI TAKASHI;HOSAKA MASAKI
分类号 H05K3/00 主分类号 H05K3/00
代理机构 代理人
主权项
地址