发明名称 |
REPLACEMENT METHOD OF PRINTED WIRING BOARD FOR PRODUCT SHEET |
摘要 |
<p>PROBLEM TO BE SOLVED: To easily adsorb and convey a product sheet by improving a packaging density of a printed wiring board in the product sheet.SOLUTION: A replacement method of a printed wiring board for a product sheet includes the steps of: removing a defective printed wiring board 10B from a product sheet 1; extracting a non-defective printed wiring board 10A from another product sheet; positioning and mounting the non-defective printed wiring board 10A in a predetermined location on a first pin board 20; positioning and affixing the non-defective printed wiring board 10A with a first jig board 30; positioning and affixing the product sheet 1 from which the defective printed wiring board 10B has been removed on a second jig board 40; mounting both the jig boards 30 and 40 on a second pin board 50 in such a manner that the non-defective printed wiring board 10A on the first jig board 30 and the product sheet 1 on the second jig board 40 oppose each other at a replacement position 4; and positioning and fixing the non-defective printed wiring board 10A on the product sheet 1 through thermal compression bonding.</p> |
申请公布号 |
JP2015095636(A) |
申请公布日期 |
2015.05.18 |
申请号 |
JP20130236166 |
申请日期 |
2013.11.14 |
申请人 |
FUJIKURA LTD |
发明人 |
MOCHIZUKI KAZUTAKA;KODAMA TAKASHI;NAKAMICHI TAKASHI;HOSAKA MASAKI |
分类号 |
H05K3/00 |
主分类号 |
H05K3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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