发明名称 |
LID BODY, PACKAGE, ELECTRONIC APPARATUS, MOVABLE BODY, AND MANUFACTURING METHOD OF PACKAGE |
摘要 |
PROBLEM TO BE SOLVED: To reduce sealing failure by accurately specifying a position of a groove to be sealed even with variation of a position of joining a container and a lid body so as to prevent insufficient sealing.SOLUTION: A lid 92 as a lid body includes: a first surface 92b; a second surface 92a in a front-back relation with the first surface 92b; an outer peripheral surface 92c connecting the first surface 92b and the second surface 92a; a groove 94 provided on the first surface 92b in a direction from the outer peripheral surface 92c toward a center part of the first surface 92b; and a first mark 96 and a second mark 106 which are provided on the second surface 92a and which are arranged at positions not overlapping with an outer peripheral edge of the second surface 92a in plan view. |
申请公布号 |
JP2015094614(A) |
申请公布日期 |
2015.05.18 |
申请号 |
JP20130232791 |
申请日期 |
2013.11.11 |
申请人 |
SEIKO EPSON CORP |
发明人 |
MATSUZAWA JUICHIRO |
分类号 |
G01C19/5628;H01L23/02;H01L41/053;H01L41/113 |
主分类号 |
G01C19/5628 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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