| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a printed circuit board having high connection reliability.SOLUTION: A printed circuit board comprises: through hole lands 36FR, 36SR which cover a through hole conductor 36 of a core substrate 30 and a filling resin 37; and via lands 58FP, 58SP which are formed in interlayer resin insulation layers 50F, 50S formed on the through hole lands, respectively and connected with center via conductors 60FPC, 60SPC by a plurality of circumferential via conductors 60FPO, 60SPO, respectively.</p> |
