APPARATUS FOR REFLOW AND METHOD FOR THE SAME

摘要

Disclosed are reflow apparatus and method. Provided are a reflow apparatus which includes a heating part storing a substrate where a solder is printed, and heating the substrate to melt the solder; a processor connected with the heating part, and cooling high temperature gas discharged from the heating part; and a cooling part cooling the substrate discharged from the heating part by using the low temperature gas cooled in the processor for the molten solder to be cured.