| 摘要 |
PROBLEM TO BE SOLVED: To provide a small-sized, highly reliable semiconductor device.SOLUTION: A semiconductor device 1 comprises: a contour strip lead frame 20 having a thick portion 21 and a thin portion 22 which is thinner than the thick portion 21; a chip mounting portion 30 on which a semiconductor chip 31 is mounted; a relay portion 40 connected to a connection portion 32 of the semiconductor chip 31 by a lead wire 33; and a connection terminal 50 connected to the relay portion 40. The thick portion 21 having a predetermined width is formed in the central portion of the contour strip lead frame 20 in a Y direction, along an X direction perpendicular to the Y direction. The thin portion 22 is formed on both outer sides of the thick portion 21 in the X direction, and the chip mounting portion 30 is formed in the thick portion 21. The relay portion 40 is formed in the thick portion 21, separately from the chip mounting portion 30. The connection terminal 50 is formed in the thin portion 22. |
