SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS

摘要

PROBLEM TO BE SOLVED: To provide a substrate processing method capable of detaching a substrate from an electrostatic chuck.SOLUTION: A substrate processing method using a substrate processing apparatus which has an electrostatic chuck including an insulating member having an electrode inside and performs a plasma treatment on a substrate placed on the electrostatic chuck comprises: a first process of supplying a heat transfer gas at a second gas pressure to a rear face of the substrate while performing plasma neutralization on the substrate in use of plasma of a process gas having a first gas pressure.